Abstract
As for many other electronic devices and circuits, electrical contact to surface acoustic wave sensors is usually made using bonding wires. This technique is known to result in reliable contact under most conditions, but it does so with several disadvantages. First, electrical contact is not reversible, impeding replacement of sensor devices. Second, bonding wires are quite delicate and should not be exposed to high gas or liquid flows. Third, the presence of bonding wires may limit the potential to miniaturize a sensor housing or flow cell. Therefore, a capacitive coupling technique was developed to replace bonding wires. This permitted redesign of flow cells and sensor arrays, resulting in flow cell volumes of 80 microL to 60 nL. As a consequence, response times were reduced to 1-2 s in gas sensing and a few minutes in liquid sensing, respectively. At the same time, sensor devices can be easily replaced, and the system is less susceptible to malfunction.
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